Stress versus temperature dependent activation energies in creep /

Bibliographic Details
Main Author:	Freed, Alan David
Corporate Author:	United States. National Aeronautics and Space Administration
Other Authors:	Raj, Sai V., Walker, K. P. (Kevin P.)
Format:	Government Document Microform Book
Language:	English
Published:	[Washington, D.C.] : NASA ; [1990?]
Series:	NASA technical memorandum ; 103192.
Subjects:	Copper > Creep. Activation energy. Creep properties. Gibbs free energy. Stresses. Temperature dependence.
Online Access:	https://purl.fdlp.gov/GPO/LPS68891

Description
Item Description:	"Performing organization report number: E-5580"--Technical rept. documentation p. Cover title. Shipping list number: 91-0093-M. Microform.
Physical Description:	10 pages : illustrations Also available via Internet from the NASA Technical Report Server web site. Address as of 4/18/06: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19900014457%5F1990014457.pdf; current access available via PURL.
Bibliography:	Includes bibliographical references (pages 9-10).