Creep deformation and fracture, design, and life extension : proceedings of a symposium sponsored by Materials Science & Technology 2005 (MS&T'05) : held in Pittsburgh, Pennsylvania, USA, September 25-28, 2005 /

Bibliographic Details
Corporate Author:	Materials Science & Technology Conference
Other Authors:	Mishra, Rajiv S.
Format:	Conference Proceeding Book
Language:	English
Published:	[Danvers, Mass.] : [Copyright Clearance Center], [2005]
Subjects:	Alloys > Creep > Congresses. Heat resistant materials > Creep > Congresses. Fracture mechanics > Congresses.

Description
Physical Description:	ix, 310 pages : illustrations ; 24 cm.
Bibliography:	Includes bibliographical references and indexes.