SISPAD ...
| Corporate Authors: | , , , , |
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| Format: | Conference Proceeding Software |
| Language: | English |
| Published: |
Wien ; New York :
Springer.
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| Subjects: |
| Item Description: | Description based on: 2004; title from disk label. Conference takes place in turn in Europe, Japan, and the USA. European conferences published by Springer Verlag and have title: Simulation of semiconductor processes and devices. Electronic resource. |
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| Physical Description: | CD-ROM : illustrations ; 4 3/4 in. Also available in print. |