Cover Image

Photonics packaging and integration V : 27 January 2005, San Jose, California, USA /

Bibliographic Details
Corporate Author: Society of Photo-optical Instrumentation Engineers
Other Authors: Heyler, Randy A., Chen, Ray T.
Format: Book
Language:English
Published: Bellingham, Washington : SPIE, [2005]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 5731.
Subjects:
Optoelectronic devices > Design and construction > Congresses.
Optical interconnects > Congresses.
Microelectronic packaging > Congresses.
Photonics > Congresses.
Description
Item Description:Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration.
Physical Description:v, 136 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0819457051