rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Materials, integration and packaging issues for high-frequency devices II
    sub title: symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A
  title info:
    title: Materials, integration and packaging issues for high-frequency devices two
  title info:
    title: Materials, integration and packaging issues for high-frequency devices 2
  name:
    name part: Cho, Yong S.
  name:
    name part: Materials Research Society
  name:
    name part: Materials Research Society
    name part: Fall Meeting
    name part: (2004 : Boston, Mass.)
  name:
    name part: Symposium on Materials, Integration and Packaging Issues for High-Frequency Devices (2004 : Boston, Mass.)
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: pau
    date issued: 2005
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: xi, 270 pages : illustrations ; 24 cm.
  note: editors, Yong S. Cho [and others].
  note: "This volume presents papers from Symposium G, 'Materials, Integration and Packaging Issues for High-Frequency Devices II, ' held November 29-December 1 at the 2004 MRS Fall Meeting in Boston, Massachusetts ..."--preface.
  note: Includes bibliographical references and indexes.
  subject:
    topic: Electronic packaging
    topic: Materials
    genre: Congresses
  related item:
    title info:
      title: Materials Research Society symposia proceedings ; v. 833
  identifier: 1558997814
  record info:
    record content source: LHL
    record creation date: 050516
    record change date: 20151101190132.0
    record identifier: in00002058947