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Materials, integration and packaging issues for high-frequency devices II
symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A
Materials, integration and packaging issues for high-frequency devices two
Materials, integration and packaging issues for high-frequency devices 2
Symposium on Materials, Integration and Packaging Issues for High-Frequency Devices (2004 : Boston, Mass.)
"This volume presents papers from Symposium G, 'Materials, Integration and Packaging Issues for High-Frequency Devices II, ' held November 29-December 1 at the 2004 MRS Fall Meeting in Boston, Massachusetts ..."--preface.
Includes bibliographical references and indexes.
Materials Research Society symposia proceedings ; v. 833