Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A. /
| Corporate Authors: | , , |
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| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Warrendale, Pa. :
Materials Research Society,
[2005]
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| Series: | Materials Research Society symposia proceedings ;
v. 833. |
| Subjects: |
| Item Description: | "This volume presents papers from Symposium G, 'Materials, Integration and Packaging Issues for High-Frequency Devices II, ' held November 29-December 1 at the 2004 MRS Fall Meeting in Boston, Massachusetts ..."--preface. |
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| Physical Description: | xi, 270 pages : illustrations ; 24 cm. |
| Bibliography: | Includes bibliographical references and indexes. |
| ISBN: | 1558997814 |