http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Reliability, packaging, testing, and characterization of MEMS/MOEMS IV
24-25 January 2005, San Jose, California, USA
Reliability, packaging, testing and characterization of MEMS/MOEMS four
Reliability, packaging, testing and characterization of MEMS/MOEMS 4
Reliability, testing and characterization of MEMS/MOEMS
Society of Photo-optical Instrumentation Engineers
Semiconductor Equipment and Materials International
xliii, 220 pages : illustrations ; 28 cm.
Danelle M. Tanner, Rajeshuni Ramesham, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, SEMI--Semiconductor Equipment and materials International, Solid State Technology [and] Sandia National Laboratories (USA).
Previous conferences entitled: Reliability, testing, and characterization of MEMS/MOEMS
Includes bibliographical references and index.
Proceedings of SPIE--the International Society for Optical Engineering ; v. 5716