Cover Image

Electronic and photonics packaging, electrical systems design and photonics, and nanotechnology--[2004] : presented at 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California, USA /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : ASME, [2004]
Series:EPP (Series) ; v. 4.
Subjects:
Electronic packaging > Congresses.
Photonics > Congresses.
Nanotechnology > Congresses.
Microelectronic packaging > Congresses.
Surface mount technology > Congresses.
Microelectromechanical systems > Congresses.
Integrated circuits > Wafer-scale integration > Congresses.
Description
Physical Description:xi, 586 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and author index.
ISBN:0791847071
9780791847077