Wafer bonding : applications and technology /
| Other Authors: | Alexe, M. (Marin), Gösele, U. |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Berlin ; New York :
Springer-Verlag,
[2004]
|
| Series: | Springer series in materials science ;
75. |
| Subjects: |
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