Wafer bonding : applications and technology /

Bibliographic Details
Other Authors:	Alexe, M. (Marin), Gösele, U.
Format:	Book
Language:	English
Published:	Berlin ; New York : Springer-Verlag, [2004]
Series:	Springer series in materials science ; 75.
Subjects:	Semiconductors > Bonding. Semiconductor wafers.

Description
Physical Description:	xv, 499 pages : illustrations (some color) ; 25 cm.
Bibliography:	Includes bibliographical references and index.
ISBN:	3540210490 (alk. paper)
ISSN:	0933-033X ;