APA (7th ed.) Citation

Alexe, M., & Gösele, U. (2004). Wafer bonding: Applications and technology. Springer-Verlag.

Chicago Style (17th ed.) Citation

Alexe, M., and U. Gösele. Wafer Bonding: Applications and Technology. Berlin ; New York: Springer-Verlag, 2004.

MLA (9th ed.) Citation

Alexe, M., and U. Gösele. Wafer Bonding: Applications and Technology. Springer-Verlag, 2004.