Advanced wirebond interconnection technology /

Potentially defective external lead-wire connections in Barton pressure transmitters.
Published: (2006)

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
by: Lee, Ning-Cheng
Published: (2002)

Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies /
by: Lee, Ning-Cheng
Published: (2002)

Electronic materials and processes handbook /
Published: (2003)

Copper wire bonding /
by: Chauhan, Preeti S.
Published: (2013)

Quality conformance and qualification of microelectronic packages and interconnects /
Published: (1994)

Copper interconnect technology /
by: Steinbruchel, Christoph
Published: (2001)

Electronic packaging for high reliability; low cost electronics /
Published: (1999)

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
by: Lee, Ning-Cheng
Published: (2002)

Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /
Published: (1993)

Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials /
Published: (2003)

Lead-free solder interconnect reliability /
Published: (2005)

Wiring and cable designer's handbook /
by: Matisoff, Bernard S., 1930-
Published: (1987)

Materials for high-density electronic packaging and interconnection.
Published: (1990)

Electronic packaging, microelectronics, and interconnection dictionary /
by: Harper, Charles A.
Published: (1993)

Design for reliability /
Published: (2001)

Guidebook for managing silicon chip reliability /
by: Pecht, Michael
Published: (1999)

Electronic equipment packaging technology /
by: Ginsberg, Gerald L.
Published: (1992)

Electronic packaging and interconnection handbook /
by: Harper, Charles A.
Published: (2005)

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A. /
Published: (2007)

Fundamentals of microfabrication /
by: Madou, Marc J.
Published: (1997)

Electronic packaging science and technology /
by: Tu, K. N. (King-Ning), 1937-, et al.
Published: (2022)

Multichip modules : systems advantages, major constructions, and materials technologies /
Published: (1991)

Influence of temperature on microelectronics and system reliability /
by: Lall, Pradeep
Published: (1997)

Polymeric materials for electronics packaging and interconnection /
Published: (1989)

Fundamentals of microsystems packaging /
Published: (2001)

Ceramic interconnect technology handbook /
Published: (2007)

Flexible electronic packaging and encapsulation technology /
Published: (2024)

Advances in electronic circuit packaging.
Published: (1962)

Plastic packaging of microelectronic devices /
by: Manzione, Louis T.
Published: (1990)

Electronic packaging materials science II : symposium held April 15-18, 1986, Palo Alto, California, U.S.A. /
Published: (1986)

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. /
Published: (1997)

Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A. /
Published: (1991)

Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. /
Published: (1985)

Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. /
Published: (1988)

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. /
Published: (1998)