Cover Image

Advanced wirebond interconnection technology /

Show other versions (1)
Bibliographic Details
Main Author: Prasad, Shankara K.
Format: Book
Language:English
Published: Boston : Kluwer Academic Publishers, [2004]
Subjects:
Wire bonding (Electronic packaging) > Production control.
Electronic packaging > Reliability.
Description
Physical Description:xxviii, 668 pages : illustrations ; 25 cm + 1 CD-ROM (4 3/4 in.).
Bibliography:Includes bibliographical references (pages [655]-660) and index.
ISBN:1402077629 (acid-free paper)
1402077637 (E-ISBN)