http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Handbook of lead-free solder technology for microelectronic assemblies
Background and Driving Forces -- Overview of Lead-Free Solder Issues Including Selection / Karl J. Puttlitz -- Health and Environmental Effects of Lead and Other Commonly Used Elements in Microelectronics / Edwin B. Smith III -- Environmental Impact of Lead and Alternatives in Electronics / Laura J. Turbini, Dennis Bernier -- Environmental Stewardship with Regional Perspectives and Drives of the Lead-Free Issue / Susanna Pelzel, Minna Juuti, Yukio Sugimoto -- Market, Product, and Corporate Policy Trends / E. Jan Vardaman -- Materials and Manufacturing Considerations -- The Metallurgical Aspects, Properties, and Applications of Solders from the Lead-Tin System / Paul T. Vianco -- Physical Basis for Mechanical Properties of Solders / Morris E. Fine -- Sn-Ag and Sn-Ag-X Solders and Properties / Karl J. Puttlitz -- Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties / Sung K. Kang -- High-Temperature Lead-Free Solders with Dispersoids / K. N. Subramanian, Sunglak Choi, Fu Guo -- Solder Wetting and Spreading / Timothy J. Singler, Stephan J. Meschter, James Spalik -- Lead-Free Finishes for Printed Circuit Boards and Components / Rob Schetty -- Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints / Eric J. Cotts, Richard Chromik, Peter Borgesen, Robert Kinyanjui, Anis Zribi -- Electronics Assembly and the Impact of Lead-Free Materials / Anthony A. Primavera -- Use of Inert Atmospheres in Lead-Free Soldering / Martin Theriault, Jason Uner, Armin Rahn.
edited by Karl J. Puttlitz, Kathleen A. Stalter.
Includes bibliographical references and index.
Mechanical engineering (Marcel Dekker, Inc.) ; 170