rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Handbook of lead-free solder technology for microelectronic assemblies
  name:
    name part: Puttlitz, Karl J.
  name:
    name part: Stalter, Kathleen A.
  type of resource: text
  genre: bibliography
  origin info:
    place:
      place term: nyu
    date issued: 2004
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: xi, 1026 pages : illustrations ; 27 cm.
  table of contents: Background and Driving Forces -- Overview of Lead-Free Solder Issues Including Selection / Karl J. Puttlitz -- Health and Environmental Effects of Lead and Other Commonly Used Elements in Microelectronics / Edwin B. Smith III -- Environmental Impact of Lead and Alternatives in Electronics / Laura J. Turbini, Dennis Bernier -- Environmental Stewardship with Regional Perspectives and Drives of the Lead-Free Issue / Susanna Pelzel, Minna Juuti, Yukio Sugimoto -- Market, Product, and Corporate Policy Trends / E. Jan Vardaman -- Materials and Manufacturing Considerations -- The Metallurgical Aspects, Properties, and Applications of Solders from the Lead-Tin System / Paul T. Vianco -- Physical Basis for Mechanical Properties of Solders / Morris E. Fine -- Sn-Ag and Sn-Ag-X Solders and Properties / Karl J. Puttlitz -- Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties / Sung K. Kang -- High-Temperature Lead-Free Solders with Dispersoids / K. N. Subramanian, Sunglak Choi, Fu Guo -- Solder Wetting and Spreading / Timothy J. Singler, Stephan J. Meschter, James Spalik -- Lead-Free Finishes for Printed Circuit Boards and Components / Rob Schetty -- Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints / Eric J. Cotts, Richard Chromik, Peter Borgesen, Robert Kinyanjui, Anis Zribi -- Electronics Assembly and the Impact of Lead-Free Materials / Anthony A. Primavera -- Use of Inert Atmospheres in Lead-Free Soldering / Martin Theriault, Jason Uner, Armin Rahn.
  note: edited by Karl J. Puttlitz, Kathleen A. Stalter.
  note: Includes bibliographical references and index.
  subject:
    topic: Solder and soldering
  subject:
    topic: Microelectronics
  subject:
    topic: Green products
  subject:
    topic: Environmental protection
  classification: TK7870.15 .H3657 2004
  classification: 621.381
  related item:
    title info:
      title: Mechanical engineering (Marcel Dekker, Inc.) ; 170
  identifier: 0824748700
  identifier: 9780824748708
  identifier: 2004300845
  identifier: http://catdir.loc.gov/catdir/enhancements/fy0647/2004300845-d.html
  identifier: http://www.e-streams.com/es0711/es0711_3692.html
  related item:
    location:
      url: http://catdir.loc.gov/catdir/enhancements/fy0647/2004300845-d.html
  related item:
    location:
      url: http://www.e-streams.com/es0711/es0711_3692.html
  record info:
    record content source: TEF
    record creation date: 040325
    record change date: 20151026060334.0
    record identifier: in00001833122