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MEMS packaging /

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Bibliographic Details
Corporate Author: Institution of Electrical Engineers
Other Authors: Hsu, Tai-Ran
Format: Book
Language:English
Published: London : Institution of Electrical Engineers, [2004]
Series:EMIS processing series ; no. 3.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
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Published 2004
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