MEMS packaging /

MEMS/MOEMS packaging : concepts, designs, metarials, and processes /
by: Gilleo, Ken
Published: (2005)

Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May 2002, Cannes, France /
Published: (2002)

Design, test, integration, and packaging of MEMS/MOEMS 2001 : 25-27 April 2001, Cannes, France /
Published: (2001)

MEMS packaging /
Published: (2004)

Selected papers on optical MEMS /
Published: (1999)

Fundamentals of Microelectromechanical Systems (MEMS) /
by: Kim, Eun Sok
Published: (2021)

Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches /
by: Knight, Ryan, et al.
Published: (2014)

Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January 2007, San Jose, California, USA /
Published: (2007)

Reliability, packaging, testing, and characterization of MEMS/MOEMS V : 25-26 January 2006, San Jose, California, USA /
Published: (2006)

Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA /
Published: (2008)

Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December 2001, Adelaide, Australia /
Published: (2001)

2000 HD International Conference on High-Density Interconnect and Systems Packaging : 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA /
Published: (2000)

Hermeticity testing of MEMS and microelectronic packages /
by: Costello, Suzanne, et al.
Published: (2013)

Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia /
Published: (1999)

Design, test, integration, and packaging of MEMS/MOEMS : 9-11 May 2000, Paris, France /
Published: (2000)

Microelectronic structures and MEMS for optical processing IV : 21-22 September 1998, Santa Clara, California /
Published: (1998)

Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California /
Published: (2001)

MEMS design, fabrication, characterization, and packaging : 30 May-1 June 2001, Edinburgh, UK /
Published: (2001)

Micromechanics and nanoscale effects : MEMS, multi-scale matrials [as printed] and micro-flows /
Published: (2004)

Education in microelectronics and MEMS : 28-29 October 1999, Royal Pines Resort, Queensland, Australia /
Published: (1999)

Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore /
Published: (2000)

Design, test, integration and packaging of MEMS/MOEMS.

MEMS : fundamental technology and applications /
Published: (2013)

MEMS : introduction and fundamentals /
Published: (2006)

Advanced electronic packaging.
Published: (2006)

Enabling technology for MEMS and nanodevices /
Published: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /
Published: (2004)

Advanced electronic packaging : with emphasis on multichip modules /
Published: (1999)

Microelectronics interconnection and packaging /
Published: (1980)

Microelectronic packaging and laser processing : 25-26 June 1997, Singapore /
Published: (1997)

Microelectronics packaging handbook /
Published: (1997)

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
Published: (1991)

Nano- and microtechnology : materials, processes, packaging and systems : 16-18 December 2002, Melbourne, Australia /
Published: (2002)

Materials science of microelectromechanical systems (MEMS) devices /
Published: (1999)

Photonics packaging and integration III : 28-30 January 2003, San Jose, California, USA /
Published: (2003)

Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /
Published: (1991)