rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Advances in electronic packaging, 2003
    sub title: presented at 2003 International Electronic Packaging Technical Conference and Exhibition : July 6-11, 2003, Maui, Hawaii
  title info:
    title: InterPACK'03
  name:
    name part: American Society of Mechanical Engineers
    name part: Electronic and Photonic Packaging Division.
  name:
    name part: International Electronic Packaging Technical Conference and Exhibition (2003 : Maui, Hawaii)
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: nyu
    date issued: 2003
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: 2 volumes : illustrations ; 28 cm.
  note: sponsored by the Electronic and Photonic Packaging Division, ASME.
  note: "... InterPACK'03 ..."--p. iii.
  note: Includes bibliographical references and author index.
  subject:
    topic: Electronic packaging
    genre: Congresses
  identifier: 0791836908
  record info:
    record content source: LHL
    record creation date: 031112
    record change date: 20151025130634.0
    record identifier: in00001790842