http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
presented at 2003 International Electronic Packaging Technical Conference and Exhibition : July 6-11, 2003, Maui, Hawaii
American Society of Mechanical Engineers
Electronic and Photonic Packaging Division.
International Electronic Packaging Technical Conference and Exhibition (2003 : Maui, Hawaii)
sponsored by the Electronic and Photonic Packaging Division, ASME.
Includes bibliographical references and author index.