Cover Image

Semiconductor international.

Bibliographic Details
Previous Title:Electronic packaging and production
Format: Journal
Language:English
Published: [Newton, Mass. etc.] : [Cahners Pub. Co., etc.]
Subjects:
Semiconductor industry > Periodicals.
Semiconductors > Periodicals.
Online Availability: Check for online availability
Description
Published:Vol. 1 (Nov./Dec. 1978)-
Ceased with: Vol. 33, no. 4 (April 2010).
Item Description:"Processing, assembly & testing."
Physical Description:volumes : illustrations ; 28 cm.
Also issued on microfiche and on the World Wide Web.
Publication Frequency:Monthly, except semi-monthly in June, Oct. 2003-
ISSN:0163-3767
0013-4945
Related Items:Semiconductor international. Technical product reference source <1994/98->, Product data source <1997->; and Semisource, <1999->
Absorbed: Electronic packaging and production.