Cover Image

Thermal conductivity 24, thermal expansion 12 /

Bibliographic Details
Corporate Authors: International Thermal Conductivity and Thermal Expansion Joint Conferences Pittsburg, Pennsylvania, NetLibrary, Inc, ITCC, Inc, Anter Corporation (Pittsburgh, Pennsylvania)
Other Authors: Gaal, Peter S., Apostolescu, Daniela E.
Format: Conference Proceeding eBook
Language:English
Published: Lancaster, Pa. : Techmonic, [1999]
Subjects:
Heat > Conduction > Congresses.
Solids > Thermal properties > Congresses.
Materials > Thermal properties > Congresses.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Proceedings of the Joint twenty-fourth and twelfth International Thermal Conductivity and Thermal Expansion Conferences, sponsored by the Anter Corporation, held October 26-29, 1997, in Pittsburg, Pennsylvania.
Electronic resource.
Physical Description:xvii, 806 pages : illustrations ; 26 cm.
Bibliography:Includes bibliographical references and indexes.
ISBN:058534955X (electronic bk.) :