Cover Image

Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December 2001, Adelaide, Australia /

Bibliographic Details
Corporate Authors: Society of Photo-optical Instrumentation Engineers, United States. Air Force. Asian Office of Aerospace Research and Development, Institute of Electrical and Electronics Engineers. South Australia Section
Other Authors: Franzon, Paul D.
Format: Book
Language:English
Published: Bellingham, Washington : SPIE, [2001]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 4593.
Subjects:
Microelectromechanical systems > Design and construction > Congresses.
Microelectronic packaging > Congresses.
Description
Physical Description:ix, 322 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0819443239