Cover Image

Proceedings First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics : incoporating POLY, PEP & Adhesives in Electronics : presented at Polytronic 2001, Potsdam, Germany, October 21-24, 2001 /

Bibliographic Details
Corporate Author: International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Potsdam, Germany
Other Authors: Aschenbrenner, Rolf
Format: Conference Proceeding Book
Language:English
Published: Piscataway, N.J. : Institute of Electrical and Electronicsal Engineers, [2001]
Subjects:
Polymers > Congresses.
Microelectronic packaging > Materials > Congresses.
Integrated circuits > Reliability > Congresses.
Photonics > Materials > Congresses.
Polymeric composites > Congresses.
Description
Physical Description:xv, 376 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0780372204