rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Advances in electronic packaging, 2001
    sub title: presented at the Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition : July 8-13, 2001, Kauai, Hawaii
  title info:
    title: InterPACK'01
  name:
    name part: Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (2001 : Kauai, Hawaii)
    role:
      role term: creator
  name:
    name part: Lee, Yung-Cheng.
  name:
    name part: American Society of Mechanical Engineers
    name part: Electrical and Electronic Packaging Division.
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: nyu
    date issued: 2001
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: 3 volumes : illustrations ; 28 cm.
  note: sponsored by the Electrical and Electronic Packaging Division, ASME ; [edited by Yung-Cheng Lee].
  note: "... INterPACK'01 ..."--p. [i].
  note: Includes bibliographic references and author index.
  subject:
    topic: Electronic packaging
    genre: Congresses
  related item:
    title info:
      title: EEP (Series) ; vol. 26
  identifier: 0791835405
  record info:
    record content source: LHL
    record creation date: 011114
    record change date: 20151023114041.0
    record identifier: in00001647947