Advances in electronic packaging, 2001 : presented at the Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition : July 8-13, 2001, Kauai, Hawaii /

Bibliographic Details
Corporate Authors:	Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference Kauai, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors:	Lee, Yung-Cheng
Format:	Conference Proceeding Book
Language:	English
Published:	New York, New York : American Society of Mechanical Engineers, [2001]
Series:	EEP (Series) ; vol. 26.
Subjects:	Electronic packaging > Congresses.

Description
Item Description:	"... INterPACK'01 ..."--p. [i].
Physical Description:	3 volumes : illustrations ; 28 cm.
Bibliography:	Includes bibliographic references and author index.
ISBN:	0791835405