http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Materials for high-density electronic packaging and interconnection
Committee on Materials for High-Density Electronic Packaging.
Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Available from Defense Technical Information Center, Cameron Station.
Electronic reproduction. Boulder, Colo. : NetLibrary, 2000. Available via World Wide Web. Access may be limited to NetLibrary affiliated libraries.