rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Reflow soldering processes and troubleshooting
    sub title: SMT, BGA, CSP, and flip chip technologies
  name:
    name part: Lee, Ning-Cheng.
    role:
      role term: creator
  type of resource: text
  genre: bibliography
  origin info:
    place:
      place term: mau
    date issued: 2002
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: 1 volume (various pagings) : illustrations ; 26 cm.
  note: Ning-Cheng Lee.
  note: Includes bibliographical references and index.
  subject:
    topic: Electronic apparatus and appliances
    topic: Design and construction
  subject:
    topic: Solder and soldering
  subject:
    topic: Electronic packaging
  subject:
    topic: Electric connectors
  classification: TK7836 .L43 2002
  classification: 621.381/046
  identifier: 0750672188 (alk. paper)
  identifier: 2001031713
  record info:
    record content source: DLC
    record creation date: 010425
    record change date: 20151023083241.0
    record identifier: in00001621225