Cover Image

Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore /

Bibliographic Details
Corporate Authors: Society of Photo-optical Instrumentation Engineers, Nanyang Technological University, Institute of Physics, Singapore
Other Authors: Tan, Cher Ming, 1959-
Format: Book
Language:English
Published: Bellingham, Wash., USA : SPIE, [2000]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 4229.
Subjects:
Microelectromechanical systems > Reliability > Congresses.
Microelectronic packaging > Congresses.
Description
Physical Description:xvii, 222 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0819439010