Cover Image

Proceedings of 2nd Electronic Packaging Technology Conference : [8-10 December, 1998, Raffles City Convention Center, Singapore] /

Bibliographic Details
Corporate Authors: Electronic Packaging Technology Conference Singapore, IEEE Reliability/CPMT/ED Singapore Chapter
Other Authors: Tay, Andrew, A. O., Lim, Thiam Beng
Format: Conference Proceeding Book
Language:English
Published: Piscataway, N.J. : IEEE, ©1998.
Subjects:
Electronic packaging > Congresses.
Mise sous boîtier (Électronique) > Congrès.
Electronic packaging.
Conference papers and proceedings.
Online Access:IEEE Xplore
Description
Item Description:"IEEE Catalog Number 98EX235"--Title page verso.
Physical Description:[vi], 361 pages : illustrations ; 30 cm
Also available via the World Wide Web with additional title: Electronics Packaging Technology Conference, 1998, proceedings of 2nd.
Bibliography:Includes bibliographical references.
ISBN:078035141X
9780780351417
0780351428
9780780351424