Mechanical analysis of electronic pakaging systems /

Electronic enclosures, housings and packages /
by: Süli, Frank
Published: (2019)

Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
Published: (1997)

Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
Published: (1995)

High-frequency characterization of electronic packaging /
by: Martens, Luc, 1963-
Published: (1998)

Applications of experimental mechanics to electronic packaging--1997-- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
Published: (1997)

Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
Published: (1995)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2016)

Advanced organics for electronic substrates and packages /
Published: (1992)

Packaging of electronic systems : a mechanical engineering approach /
by: Dally, James W.
Published: (1990)

Handbook of electronic package design /
Published: (1991)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
by: Jamnia, Ali, 1961-
Published: (2009)

Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
Published: (1994)

Electronic packaging materials and their properties /
Published: (1999)

Electronic equipment packaging technology /
by: Ginsberg, Gerald L.
Published: (1992)

Failure modes and mechanisms in electronic packages /
by: Viswanadham, Puligandla
Published: (1998)

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California /
Published: (1998)

Advanced electronic packaging : symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A. /
Published: (2007)

Principles of electronic packaging /
Published: (1989)

Advances in electronic packaging 2005 : proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, presented at 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems, July 17-22, 2005 San Fransico, California USA /
Published: (2005)

Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. /
Published: (1985)

Handbook of electronics packaging design and engineering /
by: Matisoff, Bernard S., 1930-
Published: (1990)

Essentials of electronic packaging : a multidisciplinary approach /
by: Viswanadham, Puligandla
Published: (2011)

Electronic packaging science and technology /
by: Tu, K. N. (King-Ning), 1937-, et al.
Published: (2022)

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. /
Published: (1997)

Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A. /
Published: (1991)

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
Published: (1994)

Electronic packaging materials science II : symposium held April 15-18, 1986, Palo Alto, California, U.S.A. /
Published: (1986)

Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. /
Published: (1988)

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. /
Published: (1998)

Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A. /
Published: (1989)

Electronic packaging for high reliability; low cost electronics /
Published: (1999)

Electronic packaging : materials and their properties /
Published: (1999)

Flexible electronic packaging and encapsulation technology /
Published: (2024)

Advances in electronic circuit packaging.
Published: (1962)