http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (1999 : Maui, Hawaii)
American Society of Mechanical Engineers
Electrical and Electronic Packaging Division.
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee.
Includes bibliographic references and author index.