rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Advances in electronic packaging, 1999
    sub title: proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
  title info:
    title: InterPACK '99
  name:
    name part: Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (1999 : Maui, Hawaii)
    role:
      role term: creator
  name:
    name part: Agonafer, D.
  name:
    name part: Saka, M. (Masumi)
  name:
    name part: Lee, Yung-Cheng.
  name:
    name part: American Society of Mechanical Engineers
    name part: Electrical and Electronic Packaging Division.
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: nyu
    date issued: 1999
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: 2 volumes : illustrations ; 28 cm.
  note: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee.
  note: Includes bibliographic references and author index.
  subject:
    topic: Electronic packaging
    genre: Congresses
  related item:
    title info:
      title: EEP (Series) ; vol. 26
  identifier: 0791816125
  record info:
    record content source: LHL
    record creation date: 990625
    record change date: 20151021074725.0
    record identifier: in00001504667