Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii /

Bibliographic Details
Corporate Authors:	Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference Maui, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors:	Agonafer, D., Saka, M. (Masumi), Lee, Yung-Cheng
Format:	Conference Proceeding Book
Language:	English
Published:	New York, New York : American Society of Mechanical Engineers, [1999]
Series:	EEP (Series) ; vol. 26.
Subjects:	Electronic packaging > Congresses.

Description
Physical Description:	2 volumes : illustrations ; 28 cm.
Bibliography:	Includes bibliographic references and author index.
ISBN:	0791816125