APA (7th ed.) Citation

Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference Maui, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Agonafer, D., Saka, M., & Lee, Y. (1999). Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii. American Society of Mechanical Engineers.

Chicago Style (17th ed.) Citation

Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference Maui, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, D. Agonafer, M. Saka, and Yung-Cheng Lee. Advances in Electronic Packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : Presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii. New York, New York: American Society of Mechanical Engineers, 1999.

MLA (9th ed.) Citation

Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference Maui, Hawaii, et al. Advances in Electronic Packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : Presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii. American Society of Mechanical Engineers, 1999.