Cover Image

Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components and assemblies /

Show other versions (1)
Bibliographic Details
Main Author: Martin, Perry L.
Format: Book
Language:English
Published: New York : McGraw-Hill, 1999.
Series:Electronic packaging and interconnection series.
Subjects:
Electronic apparatus and appliances > Handbooks, manuals, etc.
Microelectronics > Handbooks, manuals, etc.
Semiconductors > Handbooks, manuals, etc.
Show all versions (2)