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IEEE transactions on electronics packaging manufacturing : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society.

Bibliographic Details
New Title:IEEE transactions on advanced packaging
IEEE transactions on components and packaging technologies
IEEE transactions on components, packaging, and manufacturing technology
Previous Title:IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing
Corporate Authors: Institute of Electrical and Electronics Engineers, Components, Packaging & Manufacturing Technology Society
Format: Journal
Language:English
Published: New York, NY : Institute of Electrical and Electronics Engineers, [1999-2010]
Subjects:
Electronic apparatus and appliances > Design and construction > Periodicals.
Manufacturing processes > Periodicals.
Electronic industries > Periodicals.
Mise sous boîtier (Électronique) > Périodiques.
Fabrication > Périodiques.
Industries électroniques > Périodiques.
Appareils électroniques > Conception et construction > Périodiques.
Production, Technique de la > Périodiques.
Elektronik.
Elektronisches Bauelement.
Elektrotechnik.
Fertigungstechnik.
Werkstoff.
Zeitschrift.
Electronic apparatus and appliances > Design and construction.
Electronic industries.
Manufacturing processes.
Periodicals.
Online Availability: Check for online availability
Description
Published:Vol. 22, no. 1 (Jan. 1999)-v. 33, no. 4 (Oct. 2010).
Item Description:Title from cover.
Physical Description:volumes : illustrations ; 28 cm
Also issued online.
Publication Frequency:Quarterly
ISSN:1521-334X
1558-0822
1083-4400
1521-3323
1521-3331
2156-3950
Related Items:Merged with: IEEE transactions on advanced packaging, and: IEEE transactions on components and packaging technologies, to form: IEEE transactions on components, packaging, and manufacturing technology.