Cover Image

Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A. /

Bibliographic Details
Other Authors: Murarka, S. P.
Format: Book
Language:English
Published: Warrendale, Pa. : Materials Research Society, [1998]
Series:Materials Research Society symposia proceedings ; v. 514.
Subjects:
Electronic packaging > Materials > Congresses.
Integrated circuits > Materials > Congresses.
Semiconductors > Congresses.
Description
Physical Description:xvi, 560 pages : illustrations ; 24 cm.
Bibliography:Includes bibliographical references and indexes.
ISBN:1558994203