The effect of fan and heat sink design on heat removal from microprocessor chips /
(59.3'C) for one of the poorest performing fan/heat sink
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| Format: | Thesis eBook |
| Language: | English |
| Published: |
[Place of publication not identified] :
[publisher not identified] ;
1997.
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| Subjects: | |
| Online Access: | Link to OAKTrust copy |
| Summary: | (59.3'C) for one of the poorest performing fan/heat sink Air flow and heat removal characteristics for fan/heat sink characteristics vary greatly in their performance. At a current and voltage, wet and dry bulb temperatures, nozzle designs and were 102. 1 'F (3 8.9'C) and 123.3'F (50.7'C) designs on the top and bottom surface temperatures of the designs revealed the effects of using different fan/heat sink designs used to cool Pentium class processors were analyzed. dM3/S) with the heat sink attached. These results also elevated design. fan alone and ranged from 0.93 to 5.58 CFM (0.44 to 2.63 fan and heat sink design from a surface mounted design to an fan/heat sink design. The results of these fan performance fans ranged between 1.5 to 7.6'F (0.83 to 4.2'C) for both Five designs were tested for fan speed, differential and measuring the surface temperatures and heat flux for the CPU place. Tests with a Pentium [ ] processor and fan/heat sink processor and the heat flux at the top surface of the processor determined that an increased air flow rate over the processor will enhance heat transfer. This was shown by processor. At a CPU speed of 200 MHz, the top and bottom ranged from 1.81 to 5.88 CFM (0.85 to 2.78 dM3/S) with the respectively, for the best design. Other testing with the restricted air flow for the fans when the heat sink was in showed that all but one of the fan/heat sink designs had speed of 200 MHz. The temperature difference between the two static nozzle pressure, static fan pressure, fan input static pressure of 0.2 in. wg (49.8 Pa) the air flow rate surface temperatures were 120.6'F (49.2'C) and 138.9'F surfaces. An increased air flow rate can be obtained by temperature, barometric pressure and the fan outlet area. tests showed fans that are similar in physical These measurements were used to determine the best performing using a better fan and heat sink design or by changing the with two different fans attached to the same heat sink at a |
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| Item Description: | "Major subject: Mechanical Engineering". Vita. |
| Physical Description: | viii, 67 leaves : illustrations ; 28 cm. Also available online. Issued also on microfiche from Lange Micrographics. |
| Bibliography: | Includes bibliographical references: page 39. |