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CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors: Agonafer, D.
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, [1997]
Series:EEP (Series) ; vol. 23.
HTD (Series) ; vol. 356.
Subjects:
Electronic apparatus and appliances > Temperature control > Congresses.
Electronic systems > Thermal properties > Congresses.
Computer-aided engineering > Congresses.
Computer-aided design > Congresses.

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