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| 001 |
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| 005 |
20151020055538.0 |
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| 020 |
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|a 0791818527
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| 035 |
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|a (OCoLC)38156158
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| 035 |
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|9 AHN4768AM
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| 040 |
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|a UMC
|c UMC
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|d UtOrBLW
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| 042 |
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|a pcc
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| 049 |
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|a TXAM
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| 050 |
|
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|a TK7870.25
|b .C34 1997
|
| 245 |
0 |
0 |
|a CAE/CAD and thermal management issues in electronic systems :
|b presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
|c sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer [and others].
|
| 264 |
|
1 |
|a New York, N.Y. :
|b American Society of Mechanical Engineers,
|c [1997]
|
| 264 |
|
4 |
|c ©1997
|
| 300 |
|
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|a v, 109 pages :
|b illustrations ;
|c 28 cm.
|
| 336 |
|
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|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a unmediated
|b n
|2 rdamedia
|
| 338 |
|
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|a volume
|b nc
|2 rdacarrier
|
| 490 |
1 |
|
|a EEP;
|v vol. 23
|
| 490 |
1 |
|
|a HTD ;
|v vol. 356
|
| 504 |
|
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|a Includes bibliographical references and index.
|
| 650 |
|
0 |
|a Electronic apparatus and appliances
|x Temperature control
|x Congresses.
|
| 650 |
|
0 |
|a Electronic systems
|x Thermal properties
|x Congresses.
|
| 650 |
|
0 |
|a Computer-aided engineering
|v Congresses.
|
| 650 |
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0 |
|a Computer-aided design
|v Congresses.
|
| 700 |
1 |
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|a Agonafer, D.
|
| 711 |
2 |
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|a International Mechanical Engineering Congress and Exposition
|d (1997 :
|c Dallas, Tex.)
|
| 710 |
2 |
|
|a American Society of Mechanical Engineers.
|b Electrical and Electronic Packaging Division.
|
| 830 |
|
0 |
|a EEP (Series) ;
|v vol. 23.
|
| 830 |
|
0 |
|a HTD (Series) ;
|v vol. 356.
|
| 948 |
|
|
|a c:blr
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| 999 |
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|a MARS
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| 999 |
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| 952 |
f |
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|p ric
|a Texas A&M University
|b Rellis Campus
|c Joint Library Facility
|d Remote Storage
|t 0
|e TK7870.25 .C34 1997
|h Library of Congress classification
|i unmediated -- volume
|m A14822102485
|
| 998 |
f |
f |
|a TK7870.25 .C34 1997
|t 0
|l Remote Storage
|