APA (7th ed.) Citation

International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, & Agonafer, D. (1997). CAE/CAD and thermal management issues in electronic systems: Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. American Society of Mechanical Engineers.

Chicago Style (17th ed.) Citation

International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, and D. Agonafer. CAE/CAD and Thermal Management Issues in Electronic Systems: Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. New York, N.Y.: American Society of Mechanical Engineers, 1997.

MLA (9th ed.) Citation

International Mechanical Engineering Congress and Exposition, et al. CAE/CAD and Thermal Management Issues in Electronic Systems: Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. American Society of Mechanical Engineers, 1997.