Fundamentals of microfabrication /
| Main Author: | Madou, Marc J. |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Boca Raton, Fla. :
CRC Press,
[1997]
|
| Subjects: |
Similar Items
Fundamentals of microfabrication : the science of miniaturization /
by: Madou, Marc J.
Published: (2002)
by: Madou, Marc J.
Published: (2002)
Modelling of microfabrication systems /
by: Nassar, Raja
Published: (2003)
by: Nassar, Raja
Published: (2003)
Electronic materials and processes handbook /
Published: (2003)
Published: (2003)
Beam technologies for integrated processing : report of the Committee on Beam Technologies: Opportunities in Attaining Fully-Integrated Processing Systems, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Published: (1992)
Published: (1992)
Advanced electronic packaging : with emphasis on multichip modules /
Published: (1999)
Published: (1999)
Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
by: Lau, John H.
Published: (2000)
by: Lau, John H.
Published: (2000)
Introduction to system-on-package (SOP) : miniaturization of the entire system /
by: Tummala, Rao R., 1942-
Published: (2008)
by: Tummala, Rao R., 1942-
Published: (2008)
Introduction to system-on-package (SOP) : miniaturization of the entire system /
by: Tummala, Rao R., 1942-
Published: (2008)
by: Tummala, Rao R., 1942-
Published: (2008)
Flip chip technologies /
Published: (1996)
Published: (1996)
Chemical vapor deposition : thermal and plasma deposition of electronic materials /
by: Sivaram, Srinivasan
Published: (1995)
by: Sivaram, Srinivasan
Published: (1995)
Lasers in microelectronic manufacturing : 10-11 September 1991, San Jose, California /
Published: (1991)
Published: (1991)
Laser processing of semiconductor devices : January 18-19, 1983, Los Angeles, California /
Published: (1983)
Published: (1983)
Microlithography : science and technology /
Published: (2020)
Published: (2020)
Chip scale package (CSP) : design, materials, processes, reliability, and applications /
by: Lau, John H.
Published: (1999)
by: Lau, John H.
Published: (1999)
Polymers in microelectronics : fundamentals and applications /
by: Soane, David S., 1951-
Published: (1989)
by: Soane, David S., 1951-
Published: (1989)
Mechatronics and the design of intelligent machines and systems /
Published: (2000)
Published: (2000)
Portable consumer electronics : packaging, materials, and reliability /
by: Canumalla, Sridhar
Published: (2010)
by: Canumalla, Sridhar
Published: (2010)
Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
by: Lee, Ning-Cheng
Published: (2002)
by: Lee, Ning-Cheng
Published: (2002)
MEMS and microsystems : design and manufacture /
by: Hsu, Tai-Ran
Published: (2002)
by: Hsu, Tai-Ran
Published: (2002)
MEMS and microsystems : design, manufacture, and nanoscale engineering /
by: Hsu, Tai-Ran
Published: (2008)
by: Hsu, Tai-Ran
Published: (2008)
Area array packaging processes : for BGA, Flip Chip, and CSP /
Published: (2004)
Published: (2004)
Electronics packaging forum : multichip module technology issues /
Published: (1994)
Published: (1994)
Physical design for multichip modules /
by: Sriram, M. (Mysore), 1966-
Published: (1994)
by: Sriram, M. (Mysore), 1966-
Published: (1994)
Multichip module technology handbook /
by: Garrou, Philip E.
Published: (1998)
by: Garrou, Philip E.
Published: (1998)
Pb-free and RoHS-compliant materials and processes for microelectronics.
Published: (2007)
Published: (2007)
Advanced wirebond interconnection technology /
by: Prasad, Shankara K.
Published: (2004)
by: Prasad, Shankara K.
Published: (2004)
Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December 2001, Adelaide, Australia /
Published: (2001)
Published: (2001)
New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /
Published: (1990)
Published: (1990)
Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)
Semiconductor Packaging : Materials Interaction and Reliability.
by: Chen, Andrea
Published: (2011)
by: Chen, Andrea
Published: (2011)
Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)
Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)
Force sensors for microelectronic packaging applications /
by: Schwizer, Jürg
Published: (2005)
by: Schwizer, Jürg
Published: (2005)
Microwave and millimeter-wave electronic packaging /
by: Sturdivant, Rick
Published: (2014)
by: Sturdivant, Rick
Published: (2014)
Microelectronic packaging /
Published: (2005)
Published: (2005)
Introduction to microsystem packaging technology /
by: Jin, Yufeng
Published: (2011)
by: Jin, Yufeng
Published: (2011)
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /
Published: (2021)
Published: (2021)
Advanced electronic packaging.
Published: (2006)
Published: (2006)
Laser-assisted microtechnology /
by: Metev, S. M. (Simeon Metodiev)
Published: (1998)
by: Metev, S. M. (Simeon Metodiev)
Published: (1998)
Laser applications in microelectronic and optoelectronic manufacturing III : 26-28 January 1998, San Jose, California /
Published: (1998)
Published: (1998)