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Application of fracture mechanics in electronic packaging
presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.)
American Society of Mechanical Engineers
Electrical and Electronic Packaging Division.
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. chen, David T. Read.
Includes bibliographical references and index.