rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Application of fracture mechanics in electronic packaging
    sub title: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
  name:
    name part: International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.)
    role:
      role term: creator
  name:
    name part: Chen, William T.
  name:
    name part: Read, D. T.
  name:
    name part: American Society of Mechanical Engineers
    name part: Applied Mechanics Division.
  name:
    name part: American Society of Mechanical Engineers
    name part: Electrical and Electronic Packaging Division.
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: nyu
    date issued: 1997
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: vi, 193 pages : illustrations ; 28 cm.
  note: sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. chen, David T. Read.
  note: Includes bibliographical references and index.
  subject:
    topic: Electronic packaging
    genre: Congresses
  subject:
    topic: Fracture mechanics
    genre: Congresses
  related item:
    title info:
      title: AMD (Series) ; vol. 222
  related item:
    title info:
      title: EEP (Series) ; vol. 20
  identifier: 0791818276
  identifier: 97076706
  record info:
    record content source: UMC
    record creation date: 971216
    record change date: 20151020054620.0
    record identifier: in00001395392