Cover Image

Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/AWSME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Intersociety Electronic and Photonic Packaging Conference
Other Authors:	Suhir, Ephraim
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y : American Society of Mechanical Engineers, [1997]
Series:	EEP (Series) ; vol. 19.
Subjects:	Electronic packaging > Congresses.

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