Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/AWSME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii /
| Corporate Authors: | , |
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| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
New York, N.Y :
American Society of Mechanical Engineers,
[1997]
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| Series: | EEP (Series) ;
vol. 19. |
| Subjects: |
| Physical Description: | 2 volumes : illustrations ; 28 cm. |
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| Bibliography: | Includes bibliographic references and indexes. |
| ISBN: | 0791815595 |