Facility layout and material handling system design integration in manufacturing systems /

The interaction between the facility layout and the material

Bibliographic Details
Main Author: Yang, Taho, 1963-
Format: Thesis Book
Language:English
Published: [Place of publication not identified] : [publisher not identified] ; 1996.
Subjects:
Online Access:http://proxy.library.tamu.edu/login?url=http://proquest.umi.com/pqdweb?did=739364171&sid=1&Fmt=2&clientId=2945&RQT=309&VName=PQD
Description
Summary:The interaction between the facility layout and the material
handling system is widely recognized. The impact of these
factors on the performance of a manufacturing system is also
widely acknowledged. However, developing solution
methodologies that simultaneously determine the facility
layout and material handling system is a difficult task.
This research investigates the integrated design problems in
manufacturing systems, then proposes design procedures to
solve the integrated design problems. The integrated design
in this research refines the distance measurements based on
the type of material handling systems being used. It is
different than most existing methodologies which either solve
a material handling system design problem based on an
existing layout, or solve a layout design problem using a
loose distance approximation. This research successfully
solves the integrated layout and material handling system
design problem. The proposed methodologies are illustrated
through three specific application areas: flexible
manufacturing system with an undirected flow path, flexible
manufacturing system with a directed flow path and
semiconductor fabrication facilities. This research serves as
an important step forward towards ideal goal of completely.
integrating the facility design problems in manufacturing
systems.
Item Description:Vita.
"Major Subject: Industrial Engineering".
Physical Description:ix, 177 leaves : illustrations ; 28 cm.
Issued also on microfiche from University Microfilms Inc.
Bibliography:Includes bibliographical references: pages 82-87.