Microelectronics packaging handbook /

Bibliographic Details
Other Authors:	Tummala, Rao R., 1942-, Rymaszewski, Eugene J.
Format:	Book
Language:	English
Published:	New York : Chapman & Hall, [1997]
Edition:	2nd ed.
Subjects:	Microelectronic packaging > Handbooks, manuals, etc.

Published 1997

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