rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Microelectronics packaging handbook
  name:
    name part: Tummala, Rao R.
    name part: 1942-
  name:
    name part: Rymaszewski, Eugene J.
  type of resource: text
  genre: bibliography
  origin info:
    place:
      place term: nyu
    date issued: 1997
    edition: 2nd ed.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: 3 volumes : illustrations ; 24 cm.
  table of contents: pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.
  note: edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein.
  note: Includes bibliographical references and index.
  subject:
    topic: Microelectronic packaging
    topic: Handbooks, manuals, etc
  classification: TK7874 .M485 1997
  classification: 621.381/046
  identifier: 0412084317 (pt. 1)
  identifier: 0412084414 (pt. 2)
  identifier: 0412084511 (pt. 3)
  identifier: 96037907
  record info:
    record content source: DLC
    record creation date: 961125
    record change date: 20151005095443.0
    record identifier: in00001341417