http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.
edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein.
Includes bibliographical references and index.