Cover Image

Microelectronics packaging handbook /

Show other versions (1)
Bibliographic Details
Other Authors: Tummala, Rao R., 1942-, Rymaszewski, Eugene J.
Format: Book
Language:English
Published: New York : Chapman & Hall, [1997]
Edition:2nd ed.
Subjects:
Microelectronic packaging > Handbooks, manuals, etc.
Description
Physical Description:3 volumes : illustrations ; 24 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0412084317 (pt. 1)
0412084414 (pt. 2)
0412084511 (pt. 3)