Cover Image

Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors: Agonafer, D.
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, [1996]
Series:EEP (Series) ; vol. 18.
Subjects:
Electronic packaging > Cooling > Congresses.
Heat sinks (Electronics) > Congresses.
CAD/CAM systems > Congresses.
Computer-aided engineering > Congresses.
Computer-aided design > Congresses.
Description
Physical Description:v, 123 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791815536