| Item Description: | Conference unifies three precedent conferences: International Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (NUPAD); International Conference on Ssimulation of Semiconductor Devices and Processes (SISDEP); International Workshop on VLSI Process and Device Modeling (VPAD).
Conference takes place in turn in Europe, Japan, and the USA. European conferences published by Springer Verlag and have title: Simulation of semiconductor processes and devices. |
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