Yield learning model for integrated circuit package /
absolute metrics and compared the results to the qualitative
| Main Author: | |
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| Format: | Thesis eBook |
| Language: | English |
| Published: |
[Place of publication not identified] :
[publisher not identified] ;
1996.
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| Subjects: | |
| Online Access: | Link to OAKTrust copy |
| Summary: | absolute metrics and compared the results to the qualitative acheived. Yields can be substantially increased when one can are very critical to economic success. The integrated assembly influence on product perfo will reduce the effective been developed and implemented. Sensitivity analysis was case studies on the Tape Carrier Package at Intel chips, product quality control and rapid problem diagnosis circuit package makes up a large fraction of the total Corporation, the Plastic Quad Flat Pack and the Ceramic Ball developed a nonlinear spreadsheet-based model and tuned it to exposes the sensitivities of factors that were not factors. fit as compared to the qualitative model. This model also Grid Array at IBM, and the Plastic Ball Grid Array at have also developed a quantitative yield model based on identify the causes for yield loss. In this research a In a semiconductor industry, packaging of integrated circuit making yield predictions, resource allocations, understanding manufacturers try to improve yields to profitable levels in a manufacturing cost during assembly. Hence integrated circuit methodology to predict the yield for package assemblies has model that we developed. This model demonstrated an improved Motorola. This model has been used as a management toot for operating practices and provide what-if analysis. We performed to isolate the factors that affected yield learning production cost, and has a major influence on product perfo rmance and reliability. Increasing the yield in package short time frame and to maintain the yield once they are significant in the yield model built with the qualitative the actual yield values obtained in the assembly line. We the manufacturing line in each company. We demonstrated the the most. The yield model was developed after performing use of these models in industry to accurately predict the validated our approach by comparing the predicted yield to yield based on a set of user inputs. We have experimentally |
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| Item Description: | "Major subject: Computer Science". Vita. |
| Physical Description: | x, 40 leaves : illustrations ; 28 cm. Also available online. Issued also on microfiche from Lange Micrographics. |
| Bibliography: | Includes bibliographical references. |