Cover Image

Flip chip technologies /

Bibliographic Details
Other Authors: Lau, John H.
Format: Book
Language:English
Published: New York : McGraw-Hill, [1996]
Series:Electronic packaging and interconnection series.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics) > Design and construction.
Description
Physical Description:xxiv, 565 pages : illustrations ; 24 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0070366098 (hc)